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Entire industry chain model of photoresist, full category of semiconductor photoresist

ArF PhotoresistKrF PhotoresistI-LINE PhotoresistE-beam Photoresist Encapsulation Photoresist

KrF Photoresist

Xuzhou Bokang is a Chinese supplier of photoresist from raw materials to finished products.

PHS resin system, including high activation energy positive resist, low activation energy positive resist and negative resist, has the advantages of high resolution, etching resistance and ion implantation resistance. Thin resist is characterized by high resolution, which can reach HP120nm, thick resist is characterized by high aspect ratio, AR can reach 12:1, and has entered the client verification. At present, nearly 20+ KrF products have been verified and sold in Chinese 12-inch Fab.

Exposure wavelength Product Name Technical nodes and applications Process capability CD Process capability THK Image
248nm HTK1061 N40-14nm KrF L/S (IMP,Etch) 0.12um 0.20-0.30um
248nm HTK1062 N40-14nm KrF L/S (IMP,Etch) 0.14um 0.17-0.24um
248nm HTK1063 N40-14nm KrF L/S (IMP,Etch) 0.16um 0.22-0.32um
248nm HTK1064 N40-28nm KrF L/S (Etch) 0.16um 0.35-0.54um
248nm HTK1065 N65/55nm KrF L/S (IMP) 0.16um 0.24-0.34um
248nm HTK1066 N65/55nm KrF L/S (IMP) 0.16um 0.33-0.48um
248nm HTK1067 N40-14nm KrF L/S (IMP) 0.16um 0.33-0.48um
248nm HTK1075 N40nm-14nm KrF L/S (IMP,Etch) 0.20um 0.65-0.95um
248nm HTK1082 N40nm-14nm KrF L/S (IMP,Etch) 0.30um 0.80-1.20um
248nm HTK3001 N90-14nm KrF L/S, C/H (IMP,Etch) 0.32um 1.0-1.5um
248nm HTK5001 3DNAND Step Etching/High Energy Ion Implantation 1.70um 3.0-5.0um
248nm HTK510 Etching 2um 3.0-5.0um
248nm HTK516-1 PAD 0.6um 1.0-2.0um
248nm HTK516-2 PAD 1um 1.5-3.0um
248nm HTKN601-0.4 Compound semiconductor (Metal lift-off, KrF negative photoresist) 0.2um 0.3-0.6um
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