Encapsulation Photoresist
Xuzhou Bokang is a Chinese supplier of photoresist from raw materials to finished products.
Based on the methacrylate copolymer resin system, the series of resist samples can be applied in the thickness range of 5-120um negative packaging photoresist, which has the advantages of high resolution, high sensitivity, wide energy window, high process latitude and easy resist removal, etc. Due to the chemical plating conditions of copper, nickel, tin, silver and gold, it is widely used in advanced packaging processes such as copper bumps and rewiring. It also has good corrosion resistance and high temperature resistance, making it suitable for 3D packaging such as TSV. The technology has broad application prospects.
| Category | Product Name | Technical nodes and applications | Process capability CD | Process capability THK | Image |
|---|---|---|---|---|---|
| Encapsulation | HTF4010 | 4um | 6-12um |  |
|
| Encapsulation | HTF4025 | 4um | 17-35um |  |
|
| Encapsulation | HTF4110 | 15um | 20-110um |  |
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