In recent years, the United States has pursued a science and technology policy toward China based on "decoupling", and has continuously increased its technological restrictions and blockades on China in the field of integrated circuits. However, China 's semiconductor field currently has a low localization rate and faces "neck" in many sub-sectors. In the field of materials, the localization rate of both manufacturing materials and packaging materials is less than 10%, and the market share of domestic manufacturers of core materials such as silicon wafers is less than 5%. In terms of wafer production, TSMC, Samsung, UMC and Gexin account for 85% of the global market, and only the first two can produce advanced process chips, while SMIC, China 's leading enterprise, accounts for only 5%. In terms of equipment, AMAT, LAM, TEL, plus ASML and KLA, control 77% of the global market, and domestic manufacturers have a market share of less than 2%. In terms of IC design, design tools (EDA) and intellectual property rights (IP core) are basically owned by European and American countries. Synopsys, Cadence and Mentor Graphics occupy almost all the main tools used in the chip design process, accounting for 66.9% of the total patents. IP core is monopolized by ARM, SYNP, Cadence, Mentor and other companies. In the packaging and testing process, Chinese manufacturers occupy a certain market share, but the localization rate of packaging and testing equipment is not high, especially all kinds of packaging equipment of advanced process almost all rely on imports. Based on the development status of semiconductor industry, it is urgent to promote domestic substitution in semiconductor field at national level and accelerate the construction of independent and controllable modern industrial system.

First, the state attaches great importance to the semiconductor field to provide sufficient kinetic energy for industrial development. In recent years, in order to ensure national security, the state attaches great importance to the development of the semiconductor industry and has laid out various links in the semiconductor industry chain. Specially issued "Several Policies to Promote the High-quality Development of Integrated Circuit Industry and Software Industry in the New Era", proposing that the chip self-sufficiency rate will reach 70% by 2025;The national "14th Five-Year Plan" and the long-term goal for 2035 put forward a number of forward-looking and strategic major national science and technology projects aimed at integrated circuits and other fields. With the support of national policies, the semiconductor industry is entering the "fast lane" of accelerated development.

Second, the United States blocked China's high-end technology, prompting the semiconductor industry to speed up the localization process. Semiconductor is a high-tech industrial chain, and the first-mover advantage is extremely difficult to break. For many years, in order to compete with foreign rivals, China's semiconductor downstream wafer manufacturing enterprises are reluctant to purchase domestic materials and equipment, resulting in no opportunity for upstream manufacturers to enter the downstream industry chain. As the United States technology blockade continues to increase, it completely breaks the illusion of downstream users in China and provides market opportunities for upstream manufacturers.

Third, the strong domestic market demand strongly boosts the semiconductor industry curve overtaking. China is the largest chip market in the world, accounting for about 23% of the global demand. The demand for chips in high-tech industries such as national defense and military industry, aerospace, 5G, AI, automatic driving, medical treatment and new energy is strong. The annual import of chips exceeds USD 400 billion. The huge market stimulates the accelerated development of domestic industries.

It is suggested that China should make full use of the power of the largest single market in the world, accelerate the domestic substitution of the whole semiconductor industry chain in an all-round way, encourage domestic chip design companies to give priority to domestic chip manufacturers and domestic chip manufacturers to introduce domestic materials and equipment through government guidance and policy traction, so as to form a benign situation of common progress and development of upstream and downstream. Expand the market share of mature process, break through the advanced process, take advantage of the cluster advantage of the whole industry chain, vigorously explore the global market, break the market monopoly of high-end chips by western countries such as the United States, and comprehensively break through the blockade from both aspects of technology and market.

First, speed up industrial catch-up with "new national system". Drawing lessons from the experience of the United States, Japan and other countries in promoting the technological progress of semiconductor industry, the government organizes and mobilizes market entities and resources, conducts comprehensive and detailed investigation and investigation on the domestic semiconductor industry chain, determines the leading enterprises in each subdivision field and specific link, gives precise support to the key links of "stuck neck", and provides accurate support in project declaration, fund subsidy, tax preference, project approval and bank loan. Capital market(IPO, additional issuance, issuance of bonds, etc.) support policies and other aspects to give preference or open up green channels.

Second, strengthen industrial chain cooperation support. Set specific targets for localization rate, and use tax and financial subsidies to guide the goal. Promote active cooperation among enterprises in different links, encourage downstream customers of semiconductor industry chain to purchase and use domestic upstream products, so as to achieve the goal of being useful and usable. For mature process equipment and materials outside the foreign blockade, we will formulate guiding policies to promote the use of domestic equipment and materials in the wafer factory. Introduce special insurance products to underwrite the risks of domestic substitute products and subsidize premiums.

Third, strengthen the support for the main body of enterprises. Support enterprises to participate in international cooperation, carry out overseas mergers and acquisitions, introduce foreign high-end talents, and divide foreign blockades. For domestic substitute products, once a breakthrough is made, in order to avoid the sharp price reduction of foreign rivals, measures such as raising tariffs will be taken to protect the growth and growth of enterprises.